Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods and Design Practices
Material type:
TextSeries: ASME Press Book Series on Electronic Packaging Ed by Dereje AgonaferPublication details: American Society of Mechanical Engineers 2016 USAEdition: 2nd edDescription: 492pISBN: - 9780791861097
- 621.38104 YEH
| Item type | Current library | Item location | Collection | Call number | Status | Date due | Barcode | Item holds | |
|---|---|---|---|---|---|---|---|---|---|
Reference Book
|
NIMA Knowledge Centre | 6th Floor Silence Zone | Reference | 621.38104 YEH (Browse shelf(Opens below)) | Not For Loan | T0052209 |
List of Figures
List of Tables
Nomenclature
Foreword
Preface
Chapter: 1 Introduction
Chapter: 2 Conduction
Chapter: 3 Convection
Chapter: 4 Radiation
Chapter: 5 Pool Boiling
Chapter: 6 Flow Boiling
Chapter: 7 Condensation
Chapter: 8 Extended Surfaces
Chapter: 9 Thermal Interface Resistance
Chapter: 10 Component and Printed Circuit Board
Chapter: 11 Direct Air Cooling and Fans
Chapter: 12 Natural and Mixed Convection
Chapter: 13 Heat Exchanger and Cold Plates
Chapter: 14 Advanced Cooling Technologies I: Single Phase Liquid Cooling
Chapter: 15 Advanced Cooling Technologies II: Two Phase Flow Cooling
Chapter: 16 Heat Pipes and Others
Chapter: 17 Thermoelectric Devices
Chapter: 18 Microwave Modules and GaAs Chips
Appendices
Index
About the Author
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