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High Speed VLSI Interconnections

By: Material type: TextTextPublication details: New York Wiley International 2007Edition: 2nd edDescription: 407pISBN:
  • 9780471780465
Subject(s): DDC classification:
  • 621.395 GOE
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Item type Current library Item location Collection Call number Status Date due Barcode Item holds
Reference Book Reference Book NIMA Knowledge Centre 6th Floor Silence Zone Reference 621.395 GOE (Browse shelf(Opens below)) Not For Loan T0031626
Total holds: 0

Preliminary Concepts and More Parasitic Resistances, Capacitances and Inductances Interconnection Delays Crosstalk Analysis Electromigration Induced Failure Analysis Future Interconnections Appendices (ftp://ftp.wiley.com/public/sci_tech_med/high_speed_VLSI) Appendix 2.1: The Program IPCSGV for Calculating the Parasitic Capacitances for Single Level Inteconnections on GaAs Based Using the Green's Function Method Appendix 2.2: The Program ICIMPGV for Calculating the Parasitic Capacitances and Inductances for Multilevel Interconnections on GaAs Based (ftp://ftp.wiley.com/public/sci_tech_med/high_speed_VLSI) Using the Network Analog Method Appendix 2.3: The Program EPCSGM for Calculating the Electrode Parasitic Capacitances in a Single Gate GaAs MESFET Appendix 3.1: The Program IPDMSR for Calculating the Propagation Delay in an Interconnection Driven by Minimum Size Repeaters Appendix 3.2: The Program IPDMSR Calculating the Propagation Delays in Interconnection Driven by Minimum Size Repeaters Appendix 3.3: The Program IPDOSR for Calculating the Propagation Delays in an Interconnection Driven by Optimum Size Repeaters Appendix 3.4: The Program IPDCR for Calculating the Propagation Delays in an Interconnection Driven by Cascaded Repeaters Appendix 4.1 The Program SPBIGV for Signal Propagation Analysis of Bilevel Crossing Interconnections on GaAs Based (ftp://ftp.wiley.com/public/sci_tech_med/high_speed_VLSI) Appendix 4.2: The Program SPBIGV for Signal Propagation Analysis of Bilevel Crossing Interconnections on GaAs Based (ftp://ftp.wiley.com/public/sci_tech_med/high_speed_VLSI Appendix 5.1: The Program EMVIC for Electromigration Induced Failure Analysis of (ftp://ftp.wiley.com/public/sci_tech_med/high_speed_VLSI) Interconnection Components

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