Materials for Electronic Packaging (Record no. 47351)
[ view plain ]
| 000 -LEADER | |
|---|---|
| fixed length control field | 01683nam a2200169Ia 4500 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 140223b1995 xxu||||| |||| 00| 0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9780750693141 |
| Terms of availability | 0.00 |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.381046 |
| Item number | CHU |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Chung, Deborah D. L. |
| 245 ## - TITLE STATEMENT | |
| Title | Materials for Electronic Packaging |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication, distribution, etc. | Newton |
| Name of publisher, distributor, etc. | Butterworth-Heinemann |
| Date of publication, distribution, etc. | 1995 |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 368p |
| 500 ## - GENERAL NOTE | |
| General note | Part - 1: Overview Overview of Materials for Electronic Packaging Part - 2: Joining Solderability Fundamentals: Role of Microscopic Processes Determining the Damaging Strains which Cause Failure in Lead Tin Solders Fluxless Soldering for Microelectronic Applications The Effect of Microstructure on the Bonding of Metal Ceramic Interfaces Part - 3: Composites The Future of Advanced Composite Electronic Packaging Low Thermal Expansion Composite Materials for Electronic Packaging Electrically Conducting Polymer Matrix Composites Part - 4: Metal Films Thick-Film Technology Electroless Copper for Micropackaging and Ultra Large Scale Integrated Circuit Applications Vacuum Metallization For Integrated Circuit Packages Part - 5: Polymers and Other Materials Silicon Based Polymers in Electronic Packaging Dielectric Films for High Temperature, High Voltage Power Electronics Electrically Conducting Polymers and Organic Materials Diamond in Electronic Packages Part - 6: Materials Testing Measurements of Properties Of Materials In Electronic Packaging |
| 600 ## - SUBJECT ADDED ENTRY--PERSONAL NAME | |
| Personal name | Electronic Engineering |
| 890 ## - | |
| -- | USA |
| 995 ## - RECOMMENDATION 995 [LOCAL, UNIMARC FRANCE] | |
| -- | CHU |
| -- | 010170 |
| -- | ECT-NIT |
| -- | 8665.11 |
| -- | 0 |
| -- | 049 |
| -- | IN981 |
| -- | 0 |
| -- | 0.00 |
| -- | 12933.00 33% |
| -- | 20110120 |
| -- | 01 |
| -- | C |
| -- | 20110204 |
| -- | Kushal Books |
| -- | Reference |
No items available.