Electronics Packaging: Materials and Their Properties by Michael G. Pecht, Rakesh Agarwal, Patrick McCluskey, Terrance Dishongh, Sirus Javadpour and Rahul Mahajan
By: Pecht, Michael G.
Contributor(s): Javadpour, Sirus | Dishongh, Terrance | McCluskey, Patrick | Agarwal, Rakesh | Mahajan, Rahul.
Material type:
Item type | Current location | Collection | Call number | Status | Date due | Barcode | Item holds |
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Institute of Technology | Reference | 621.381046 PEC (Browse shelf) | Not For Loan | T0040132 |
Total holds: 0
Properties of Electronic Packaging Materials Zeroth Level Packaging Materials First Level Packaging Materials Second Level Packaging Materials Third Level Packaging Materials Summary Appendix - A Appendix - B References Index
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