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Electronics Packaging: Materials and Their Properties by Michael G. Pecht, Rakesh Agarwal, Patrick McCluskey, Terrance Dishongh, Sirus Javadpour and Rahul Mahajan

By: Pecht, Michael G.
Contributor(s): Javadpour, Sirus | Dishongh, Terrance | McCluskey, Patrick | Agarwal, Rakesh | Mahajan, Rahul.
Material type: materialTypeLabelBookSeries: The Electronic Packaging Series. Publisher: Boca Raton CRC Press 1999Description: 114p.ISBN: 9780849396250.Subject(s): Electronic EngineeringDDC classification: 621.381046
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Item type Current location Collection Call number Status Date due Barcode Item holds
Book Book Institute of Technology
Reference 621.381046 PEC (Browse shelf) Not For Loan T0040132
Total holds: 0

Properties of Electronic Packaging Materials Zeroth Level Packaging Materials First Level Packaging Materials Second Level Packaging Materials Third Level Packaging Materials Summary Appendix - A Appendix - B References Index

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