TY  - BOOK
AU  - Yeh, L. T.
TI  - Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods and Design Practices
SN  - 9780791861097
U1  - 621.38104 
PY  - 2016///
CY  - USA
PB  - American Society of Mechanical Engineers
KW  - Mechanical Engineering
N1  - List of Figures
List of Tables
Nomenclature
Foreword
Preface
Chapter: 1 Introduction
Chapter: 2 Conduction
Chapter: 3 Convection
Chapter: 4 Radiation
Chapter: 5 Pool Boiling
Chapter: 6 Flow Boiling
Chapter: 7 Condensation
Chapter: 8 Extended Surfaces
Chapter: 9 Thermal Interface Resistance
Chapter: 10 Component and Printed Circuit Board
Chapter: 11 Direct Air Cooling and Fans
Chapter: 12 Natural and Mixed Convection
Chapter: 13 Heat Exchanger and Cold Plates
Chapter: 14 Advanced Cooling Technologies I: Single Phase Liquid Cooling
Chapter: 15 Advanced Cooling Technologies II: Two Phase Flow Cooling
Chapter: 16 Heat Pipes and Others
Chapter: 17 Thermoelectric Devices
Chapter: 18 Microwave Modules and GaAs Chips
Appendices
Index
About the Author

ER  -