TY  - BOOK
AU  - Goel, Ashok K.
TI  - High Speed VLSI Interconnections
SN  - 9780471780465
U1  - 621.395 
PY  - 2007///
CY  - New York
PB  - Wiley International
KW  - Electronic Engineering
N1  - Preliminary Concepts and More Parasitic Resistances, Capacitances and Inductances Interconnection Delays Crosstalk Analysis Electromigration Induced Failure Analysis Future Interconnections Appendices (ftp://ftp.wiley.com/public/sci_tech_med/high_speed_VLSI) Appendix 2.1: The Program IPCSGV for Calculating the Parasitic Capacitances for Single Level Inteconnections on GaAs Based Using the Green's Function Method Appendix 2.2: The Program ICIMPGV for Calculating the Parasitic Capacitances and Inductances for Multilevel Interconnections on GaAs Based (ftp://ftp.wiley.com/public/sci_tech_med/high_speed_VLSI) Using the Network Analog Method Appendix 2.3: The Program EPCSGM for Calculating the Electrode Parasitic Capacitances in a Single Gate GaAs MESFET Appendix 3.1: The Program IPDMSR for Calculating the Propagation Delay in an Interconnection Driven by Minimum Size Repeaters Appendix 3.2: The Program IPDMSR Calculating the Propagation Delays in Interconnection Driven by Minimum Size Repeaters Appendix 3.3:  The Program IPDOSR for Calculating the Propagation Delays in an Interconnection Driven by Optimum Size Repeaters Appendix 3.4:  The Program IPDCR for Calculating the Propagation Delays in an Interconnection Driven by Cascaded Repeaters Appendix 4.1 The Program SPBIGV for Signal Propagation Analysis of Bilevel Crossing Interconnections on GaAs Based (ftp://ftp.wiley.com/public/sci_tech_med/high_speed_VLSI) Appendix 4.2: The Program SPBIGV for Signal Propagation Analysis of Bilevel Crossing Interconnections on GaAs Based (ftp://ftp.wiley.com/public/sci_tech_med/high_speed_VLSI Appendix 5.1: The Program EMVIC for Electromigration Induced Failure Analysis of (ftp://ftp.wiley.com/public/sci_tech_med/high_speed_VLSI) Interconnection Components
ER  -