Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods and Design Practices

By:

Yeh, L. T

Material type: Text

TextSeries: ASME Press Book Series on Electronic Packaging Ed by Dereje AgonaferPublication details: American Society of Mechanical Engineers 2016 USAEdition: 2nd edDescription: 492pISBN:

9780791861097

Subject(s):

Mechanical Engineering

DDC classification:

621.38104 YEH

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Holdings
Item type	Current library	Item location	Collection	Call number	Status	Date due	Barcode	Item holds
Reference Book	NIMA Knowledge Centre	6th Floor Silence Zone	Reference	621.38104 YEH (Browse shelf(Opens below))	Not For Loan		T0052209

Total holds: 0

List of Figures
List of Tables
Nomenclature
Foreword
Preface
Chapter: 1 Introduction
Chapter: 2 Conduction
Chapter: 3 Convection
Chapter: 4 Radiation
Chapter: 5 Pool Boiling
Chapter: 6 Flow Boiling
Chapter: 7 Condensation
Chapter: 8 Extended Surfaces
Chapter: 9 Thermal Interface Resistance
Chapter: 10 Component and Printed Circuit Board
Chapter: 11 Direct Air Cooling and Fans
Chapter: 12 Natural and Mixed Convection
Chapter: 13 Heat Exchanger and Cold Plates
Chapter: 14 Advanced Cooling Technologies I: Single Phase Liquid Cooling
Chapter: 15 Advanced Cooling Technologies II: Two Phase Flow Cooling
Chapter: 16 Heat Pipes and Others
Chapter: 17 Thermoelectric Devices
Chapter: 18 Microwave Modules and GaAs Chips
Appendices
Index
About the Author

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