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Electronic Packaging and Interconnections Handbook

By: Material type: TextTextSeries: Electronic Packaging and Interconnections SeriesPublication details: New York McGraw-Hill Companies, Inc. 2005Edition: 4th edDescription: I.14pISBN:
  • 9780071430487
Subject(s): DDC classification:
  • 621.381046 HAR
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Holdings
Item type Current library Item location Collection Call number Status Date due Barcode Item holds
Reference Book Reference Book NIMA Knowledge Centre 6th Floor Silence Zone Reference 621.381046 HAR (Browse shelf(Opens below)) Not For Loan T0040366
Total holds: 0

Plastics, Elastomers, and Composites Adhesives, Underfills, and Coatings Thermal Management Connector and Interconnection Technology Solder Technology for Electronic Packaging and Assembly Packaging and Interconnection of Integrated Circuits Hybrid Microelectronics and Multichip Modules Chip Scale, Flip Chip, and Advanced Chip Packaging Technologies Rigid and Flexible Printed Circuit Board Technology Packaging of High Speed and Microwave Electronics Systems

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