Electronic Packaging and Interconnections Handbook

By:

Harper, Charles A

Material type: Text

TextSeries: Electronic Packaging and Interconnections SeriesPublication details: New York McGraw-Hill Companies, Inc. 2005Edition: 4th edDescription: I.14pISBN:

9780071430487

Subject(s):

Computer Science

DDC classification:

621.381046 HAR

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Holdings
Item type	Current library	Item location	Collection	Call number	Status	Date due	Barcode	Item holds
Reference Book	NIMA Knowledge Centre	6th Floor Silence Zone	Reference	621.381046 HAR (Browse shelf(Opens below))	Not For Loan		T0040366

Total holds: 0

Plastics, Elastomers, and Composites Adhesives, Underfills, and Coatings Thermal Management Connector and Interconnection Technology Solder Technology for Electronic Packaging and Assembly Packaging and Interconnection of Integrated Circuits Hybrid Microelectronics and Multichip Modules Chip Scale, Flip Chip, and Advanced Chip Packaging Technologies Rigid and Flexible Printed Circuit Board Technology Packaging of High Speed and Microwave Electronics Systems

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