000			01347nam a2200169Ia 4500
008			140223b2009 xxu||||| |||| 00| 0 eng d
020			_a9780470189306 _c0.00
082			_a621.38224 _bOTT
100			_aOtt, Henry W.
245			_aElectromagnetic Compatibility Engineering
260			_aHoboken _bJohn Wiley & Sons _c2009
300			_a843p
500			_aPart - 1: EMC Theory Electromagnetic Compatibility Cabling Grounding Balancing and Filtering Passive Components Shielding Contact Protection Intrinsic Noise Sources Active Device Noise Digital Circuit Grounding Part - 2: EMC Applications Digital Circuit Power Distribution Digital Circuit Radiation Conducted Emissions RF and Transient Immunity Electrostatic Discharge PCB Layout and Stackup Mixed-Signal PCB Layout Precompliance EMC Measurements Appendix - A: The Decibel Appendix - B:The Ten Best Ways to Maximize the Emission from Your Product Appendix - C: Multiple Reflections of Magnetic Fields in Thin Shields Appendix - D: Dipoles for Dummies Appendix - E: Partial Inductance Appendix - F:Answers to Problems Index
600			_aElectronic Communication
890			_aUSA
995			_AOTT _B011194 _CECM-PG0 _D5831.19 _E0 _F049 _G110413 _H0 _I0.00 _J8606.92 32.25% _L20130719 _M03 _UC _W20130802 _XHimanshu Book Co. _ZReference
999			_c45563 _d45563