000			01065nam a2200181Ia 4500
008			140223b2000 xxu||||| |||| 00| 0 eng d
020			_a9780849385919 _c0.00
082			_a621.381046 _bELE
100			_aBlackwell, Glenn R.
245			_aElectronic Packing Handbook
260			_aBoca Raton _bCRC Press _c2000
300			_aI-15p
440			_aElectronics Handbook Series
500			_aFundamentals of the Design Process Surface Mount Technology Integrated Circuit Packages Direct Chip Attach Circuit Boards EMC and PCB Design Hybrid Assemblies Interconnects Design for Test Adhesive and Its Application Thermal Management Testing Inspection Package/Enclosure Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach Product Safety and Third-Party Certification
600			_aElectronic Engineering
890			_aUSA
995			_AELE _B010170 _CECE-PG0 _D6266.11 _E0 _F049 _GIN1109 _H0 _I0.00 _J9147.60 31.50% _L20110120 _M04 _UC _W20110228 _XKushal Books _ZReference
999			_c45586 _d45586