000			01683nam a2200169Ia 4500
008			140223b1995 xxu||||| |||| 00| 0 eng d
020			_a9780750693141 _c0.00
082			_a621.381046 _bCHU
100			_aChung, Deborah D. L.
245			_aMaterials for Electronic Packaging
260			_aNewton _bButterworth-Heinemann _c1995
300			_a368p
500			_aPart - 1: Overview Overview of Materials for Electronic Packaging Part - 2: Joining Solderability Fundamentals: Role of Microscopic Processes Determining the Damaging Strains which Cause Failure in Lead Tin Solders Fluxless Soldering for Microelectronic Applications The Effect of Microstructure on the Bonding of Metal Ceramic Interfaces Part - 3: Composites The Future of Advanced Composite Electronic Packaging Low Thermal Expansion Composite Materials for Electronic Packaging Electrically Conducting Polymer Matrix Composites Part - 4: Metal Films Thick-Film Technology Electroless Copper for Micropackaging and Ultra Large Scale Integrated Circuit Applications Vacuum Metallization For Integrated Circuit Packages Part - 5: Polymers and Other Materials Silicon Based Polymers in Electronic Packaging Dielectric Films for High Temperature, High Voltage Power Electronics Electrically Conducting Polymers and Organic Materials Diamond in Electronic Packages Part - 6: Materials Testing Measurements of Properties Of Materials In Electronic Packaging
600			_aElectronic Engineering
890			_aUSA
995			_ACHU _B010170 _CECT-NIT _D8665.11 _E0 _F049 _GIN981 _H0 _I0.00 _J12933.00 33% _L20110120 _M01 _UC _W20110204 _XKushal Books _ZReference
999			_c47351 _d47351