Materials for Electronic Packaging

Part - 1: Overview Overview of Materials for Electronic Packaging Part - 2: Joining Solderability Fundamentals: Role of Microscopic Processes Determining the Damaging Strains which Cause Failure in Lead Tin Solders Fluxless Soldering for Microelectronic Applications The Effect of Microstructure on the Bonding of Metal Ceramic Interfaces Part - 3: Composites The Future of Advanced Composite Electronic Packaging Low Thermal Expansion Composite Materials for Electronic Packaging Electrically Conducting Polymer Matrix Composites Part - 4: Metal Films Thick-Film Technology Electroless Copper for Micropackaging and Ultra Large Scale Integrated Circuit Applications Vacuum Metallization For Integrated Circuit Packages Part - 5: Polymers and Other Materials Silicon Based Polymers in Electronic Packaging Dielectric Films for High Temperature, High Voltage Power Electronics Electrically Conducting Polymers and Organic Materials Diamond in Electronic Packages Part - 6: Materials Testing Measurements of Properties Of Materials In Electronic Packaging